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EIKOH SEISAKUSYO Co., Ltd.
〒370-2455 1109-2, Kanohara, Tomioka-shi, Gunma
TEL.0274-63-2483
FAX.0274-63-2549

1.Board implementation
2.Board assembly
3.Board assembling/Examination for board
4.Examination for product assembling/product

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Facilities introduction

Here, I introduce many facilities of our possession.

Facilities are detailed

Examination for 3D appearance machine

OMRON (VT-S730)
The NG stocker deployment
NAGAOKA INTERNATIONAL mill (NS0009L TP2G)
Testable size
Max: L510mm X W460mm
Min :L60mm X W50mm
t (thickness): 0.5-2.0mm

/mounter mounted with a machine

A press: YAMAHA (YCP10)
A mounter: YAMAHA (YS24X → YS100)
A reflow: Tamura Seisakusho (TNV50-568EM-P) nitrogen
Mountable size maximum L510mm X W460mm
Minimum L60mm X W50mm
Thickness: 0.5-2.0mm
Parts height: Less than 15mm
*0.4*0.2mm is mountable

Mounter (Panasonic Line) mounted with a machine

/mounter mounted with a machine

A press: Panasonic (SP28P-D)
An examination of printing machine: RENESAS (BPC-707)
A mounter: Panasonic (CM101D ⇒ CM20F-M)
A reflow: The Tamura Seisakusho (TAP30-407PM) atmosphere
Mountable size maximum L330 X W250 X T3.0
Smallest L50 X W50 X T0.5

Examination of printing machine

/inspection machine mounted with a machine

Panasonic Line
An inspection machine: RENESAS(BPC-707)

Examination of image recognition

Examination of image recognition
7600/132 Power Macintosh
Wearing parts confirmation device
Model22X Marantz Japan, Inc.

By image recognition, I carry out the inspection such as presence, the gap of parts after the parts deployment, the parts difference.

Examination for image machine X 3

Examination for image machine
Examination for image machine OMRON (QT-SV1)

Solder tank (nitrogen correspondence)

/solder tank mounted with a machine

Jet tank * lead-free, eutectic correspondence
furakusa: Tamura Seisakusho (TAF-40-15PA)
A solder tank: Tamura Seisakusho (HC25-39NE)
Mountable size maximum L330 X W250 X T1.6
        Smallest L50 X W50 X T1.6

Solder tank

/solder tank mounted with a machine

Standstill tank * eutectic correspondence
furakusa: Nihon Dennetsu apparatus (MX-300)
A solder tank: Nihon Dennetsu apparatus (HC25-39NE)

Programmable spot soldering equipment (Taku Robo)

Programmable spot soldering equipment (Taku Robo)
 *Lead-free, eutectic correspondence
pointofurakusa device (desk model model): Koki technical center
A point jet soldering equipment (desk model model): Koki technical center
 

Desk model radioscopy device

MX-90Basic 
Hand operation X-axis (horizontal direction) = 160mm
    Y-axis (front-back direction) = 100mm

Drawer size (596mm *470mm)

mediekkusutekku

Molding (in star pack) of packing materials

/package mounted with a machine

Molding machine of the buffer material to use at the time of packing

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