Facilities introduction
Here, I introduce many facilities of our possession.
Facilities are detailed
Examination for 3D appearance machine
OMRON (VT-S730)
The NG stocker deployment
The NG stocker deployment
NAGAOKA INTERNATIONAL Seisakusho (NS0009L TP2G)
Testable size
Max: L510mm X W460mm
Min ：L60mm X W50mm
t (thickness): 0.5-2.0mm
Max: L510mm X W460mm
Min ：L60mm X W50mm
t (thickness): 0.5-2.0mm
/mounter mounted with a machine
A press: YAMAHA (YCP10)
A mounter: YAMAHA (YS24X → YS100)
A reflow: Tamura Seisakusho (TNV50-568EM-P) nitrogen
Mountable size maximum L510mm X W460mm
Minimum L60mm X W50mm
Thickness: 0.5-2.0mm
Parts height: Less than 15mm
＊0.4*0.2mm is mountable
A mounter: YAMAHA (YS24X → YS100)
A reflow: Tamura Seisakusho (TNV50-568EM-P) nitrogen
Mountable size maximum L510mm X W460mm
Minimum L60mm X W50mm
Thickness: 0.5-2.0mm
Parts height: Less than 15mm
＊0.4*0.2mm is mountable
Mounter (Panasonic Line) mounted with a machine
A press: Panasonic (SP28P-D)
An examination of printing machine: RENESAS (BPC-707)
A mounter: Panasonic (CM101D ⇒ CM20F-M)
A reflow: The Tamura Seisakusho (TAP30-407PM) atmosphere
Mountable size maximum L330 X W250 X T3.0
Smallest L50 X W50 X T0.5
Examination of printing machine
Panasonic Line
An inspection machine: RENESAS(BPC-707)
Examination of image recognition
7600/132 Power Macintosh
Wearing parts confirmation device
Model22X Marantz Japan, Inc.
By image recognition, I carry out the inspection such as presence, the gap of parts after the parts deployment, the parts difference.
Wearing parts confirmation device
Model22X Marantz Japan, Inc.
By image recognition, I carry out the inspection such as presence, the gap of parts after the parts deployment, the parts difference.
Examination for image machine X 3
Examination for image machine OMRON (QT-SV1)
Solder tank (nitrogen correspondence)
Jet tank * lead-free, eutectic correspondence
furakusa: Tamura Seisakusho (TAF-40-15PA)
A solder tank: Tamura Seisakusho (HC25-39NE)
Mountable size maximum L330 X W250 X T1.6
Smallest L50 X W50 X T1.6
Solder tank
Standstill tank * eutectic correspondence
furakusa: Nihon Dennetsu apparatus (MX-300)
A solder tank: Nihon Dennetsu apparatus (HC25-39NE)
Programmable spot soldering equipment (Taku Robo)
Programmable spot soldering equipment (Taku Robo)
＊Lead-free, eutectic correspondence
pointofurakusa device (desk model model): Koki technical center
A point jet soldering equipment (desk model model): Koki technical center
Desk model radioscopy device
MX-90Basic
Hand operation X-axis (horizontal direction) = 160mm
Y-axis (front-back direction) = 100mm
- Drawer size (596mm *470mm)
mediekkusutekku
Molding (in star pack) of packing materials
Molding machine of the buffer material to use at the time of packing